Density

ISO1183

g/cm^3

-

Water absorption (23℃, in water)

-

%

-

Deflection temperature under load (1.80MPa)

ISO75-1,2

℃

-

Deflection temperature under load (0.45MPa)

ISO75-1,2

℃

-

Linear expansion coefficient (MD: -30 to 120°C)

ISO 11359-2

×10^-5/℃

-

Linear expansion coefficient (MD: -30 to 50°C)

ISO 11359-2

×10^-5/℃

-

Linear expansion coefficient (MD: 50 to 120°C)

ISO 11359-2

×10^-5/℃

-

Linear expansion coefficient (TD: -30 to 120°C)

ISO 11359-2

×10^-5/℃

-

Linear expansion coefficient (TD: -30 to 50°C)

ISO 11359-2

×10^-5/℃

-

Linear expansion coefficient (TD: 50 to 120°C)

ISO 11359-2

×10^-5/℃

-

Melting Temperature

ISO 11357-3

℃

-

Breaking Stress

ISO527-1,2

MPa

-

Breaking Strain

ISO527-1,2

%

-

Tensile Modulus

ISO527-1,2

MPa

-

Bending strength

ISO 178

MPa

-

Flexural modulus

ISO 178

MPa

-

Charpy impact strength (unnotched, 23°C)

ISO179-1,2

kJ/m^2

-

Charpy impact strength (notched, 23°C)

ISO179-1,2

kJ/m^2

-

Volume resistivity

IEC 60093

Ω・cm

-

Surface resistance

IEC 60093

Ω

-

Dielectric constant (1MHz)

IEC 60250

-

Dielectric tangent (1MHz)

IEC 60250

-

Withstand voltage (1mmt)

IEC 60243-1

MV/m

-

Withstand voltage (2mmt)

IEC 60243-1

MV/m

-

Mold shrinkage rate MD (100×100×2mmt)

-

%

-

Mold shrinkage TD (100×100×2mmt)

-

%

-

Mold Temperature

℃

-