| Manufacturer | Sumitomo Chemical Co., Ltd. |
| Resin Name | LCP |
| Product Name | Sumika Supermarket |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ASTMD792 | Proportion | ASTMD792 | 1.58 | - | |
Water absorption Water absorption/ASTMD570 | Water absorption | ASTMD570 | % | 0.02 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ASTMD648 | Deflection temperature under load (1.82MPa) | ASTMD648 | ℃ | 250 | - |
Linear expansion coefficient (flow) Linear expansion coefficient (flow)/Sumika method | Linear expansion coefficient (150℃,MD) | Sumika method | ×10^-5/℃ | 1.1 | - |
Linear expansion coefficient (right angle) Linear expansion coefficient (right angle)/Sumika method | Linear expansion coefficient (150℃,TD) | Sumika method | ×10^-5/℃ | 7.6 | - |
Flammability Flammability/UL94 | Flame retardant | UL94 | NaN | 0.1mm |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Bending strength Bending strength/ASTMD790 | Bending strength (23℃) | ASTMD790 | MPa | 140 | - |
Flexural modulus Flexural modulus/ASTMD790 | Flexural modulus (23℃) | ASTMD790 | MPa | 9300 | - |
Izod impact strength Izod impact strength/ASTMD256 | Izod impact strength (6.4t, unnotched) | ASTMD256 | J/m | 330 | - |
Surface hardness Surface hardness/ASTMD785 | Rockwell Strength | ASTMD785 | R scale | 101 | - |
Tensile strength Tensile strength/ASTMD638 | Tensile strength | ASTMD638 | MPa | 150 | - |
Tensile elongation Tensile elongation/ASTMD638 | Tensile elongation | ASTMD638 | % | 7.4 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Volume resistivity Volume resistivity/ASTMD257 | Volume resistivity | ASTMD257 | Ω・cm | NaN | - |
Dielectric constant Dielectric constant/ASTMD150 | Dielectric constant (1MHz) | ASTMD150 | 3.8 | - | |
Dielectric loss tangent Dielectric loss tangent/ASTMD150 | Dielectric tangent (1MHz) | ASTMD150 | 0.02 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/Sumika method | Mold shrinkage rate MD | Sumika method | % | 0.22 | - |
Mold shrinkage rate TD Mold shrinkage rate TD/Sumika method | Mold shrinkage rate TD | Sumika method | % | 0.6 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/- | Standard forming temperature | - | ℃ | 350 | - |
| Main Applications |
|---|
Connector, Board to Board Connector |
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