Public Beta
Public Beta
| Manufacturer | Toyobo Co., Ltd. |
| Resin Name | PA |
| Product Name | Vylamide |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ISO 1183 | Proportion | ISO 1183 | 1.15 | - | |
Water absorption Water absorption/ISO 62 | Water absorption | ISO 62 | % | 0.21 | 24 hours in 23℃ water |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ISO 75-1,2 | Deflection Temperature under Load | ISO 75-1,2 | ℃ | 95 | 1.82MPa |
Deflection Temperature under Load | ISO 75-1,2 | ℃ | 182 | 0.46MPa | |
Linear expansion coefficient (flow) Linear expansion coefficient (flow)/ISO 11359-2 | Linear expansion coefficient MD | ISO 11359-2 | 10^-5/℃ | 7 | - |
Linear expansion coefficient (right angle) Linear expansion coefficient (right angle)/ISO 11359-2 | Linear expansion coefficient TD | ISO 11359-2 | 10^-5/℃ | 7 | - |
Flammability Flammability/UL94 | UL94 | NaN | 0.8mmt |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Bending strength Bending strength/ISO 178 | Bending strength | ISO 178 | MPa | 136 | 23℃ |
Flexural modulus Flexural modulus/ISO 178 | Flexural modulus | ISO 178 | MPa | 2800 | 23℃ |
Charpy impact strength (notched) Charpy impact strength (notched)/ISO 179-1 | Charpy impact strength (notched) | ISO 179-1 | kj/m^2 | 5 | 23℃ |
Tensile strength Tensile strength/ISO 527-1,2 | Tensile strength | ISO 527-1,2 | MPa | 85 | 23℃ |
Tensile elongation Tensile elongation/ISO 527-1,2 | Tensile elongation | ISO 527-1,2 | % | 4 | 23℃ |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Volume resistivity Volume resistivity/IEC 60093 | Volume resistivity | IEC 60093 | Ω・cm | NaN | 23℃ |
Dielectric loss tangent Dielectric loss tangent/IEC 60250 | Dielectric loss tangent | IEC 60250 | 0.01 | 23℃,1kHz | |
Dielectric Strength Dielectric Strength/IEC 60243-1 | Dielectric Breakdown Strength | IEC 60243-1 | kV/mm | 32 | 23℃ 2mmt |
Tracking resistance Tracking resistance/IEC 60112 | Tracking resistance | IEC 60112 | V | 600 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/ISO 294-4 | ISO 294-4 | % | 1.7 | 2mmt | |
Mold shrinkage rate TD Mold shrinkage rate TD/ISO 294-4 | ISO 294-4 | % | 1.7 | 2mmt | |
ＭFＲ ＭFＲ/ISO 1133 | MI | ISO 1133 | g/10min | 20 | 330℃・2,160g |
MI | ISO 1133 | g/10min | 280℃・2,160g |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Resin temperature | ℃ | - | ||
Mold Temperature Mold Temperature/ | Mold Temperature | ℃ | - |
| Key Features |
|---|
Heat aging resistance, non-reinforced |
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