| Manufacturer | Celanese Corporation |
| Resin Name | PA66 |
| Product Name | Zytel |
| ISO Material Code | PA66-I |
Blurred items can be viewed by registering or logging in.
Blurred items can be viewed by registering or logging in.
| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ISO 1183 | Density (dry) | ISO 1183 | g/cm^3 | 1.09 | - |
Water absorption Water absorption/ISO 62 | Equilibrium water absorption (2mm) (when absorbing moisture) | ISO 62 | % | 2.2 | - |
Water absorption (immersion, 24h) (when completely dry) | ISO 62 | % | 1.2 | - |
Blurred items can be viewed by registering or logging in.
Blurred items can be viewed by registering or logging in.
| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ISO 75-1/-2 | Deflection temperature under load (1.80 MPa) (when completely dry) | ISO 75-1/-2 | ℃ | 66 | - |
Deflection temperature under load (0.45 MPa) (when completely dry) | ISO 75-1/-2 | ℃ | 155 | - | |
Linear expansion coefficient (MD) Linear expansion coefficient (MD)/ISO 11359-1/-2 | Linear expansion coefficient (parallel) (when completely dry) | ISO 11359-1/-2 | x10^-5/℃ | 13.2 | - |
Linear expansion coefficient (TD) Linear expansion coefficient (TD)/ISO 11359-1/-2 | Linear expansion coefficient (right angle) (when completely dry) | ISO 11359-1/-2 | x10^-5/℃ | 13.2 | - |
Melting point Melting point/ISO 11357-1/-3 | Melting temperature (10℃/min) (when completely dry) | ISO 11357-1/-3 | ℃ | 263 | - |
Flammability Flammability/IEC 60695-11-10 | Flammability | IEC 60695-11-10 | class | NaN | 1.5mm |
Blurred items can be viewed by registering or logging in.
Blurred items can be viewed by registering or logging in.
| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile Yield Stress Tensile Yield Stress/ISO 527-1/-2 | Yield stress (absolutely dry) | ISO 527-1/-2 | MPa | 61 | - |
Yield stress (at 23℃ 50% RH equilibrium water absorption) | ISO 527-1/-2 | MPa | 43 | - | |
Tensile strain at break Tensile strain at break/ISO 527-1/-2 | Nominal breaking strain (when completely dry) | ISO 527-1/-2 | % | 35 | - |
Nominal strain at break (at 23℃ 50% RH equilibrium water absorption) | ISO 527-1/-2 | % | 50 | - | |
Tensile Modulus Tensile Modulus/ISO 527-1/-2 | Tensile modulus (when completely dry) | ISO 527-1/-2 | MPa | 2200 | - |
Tensile modulus (at 23℃ 50% RH equilibrium water absorption) | ISO 527-1/-2 | MPa | 1100 | - | |
Charpy impact strength Charpy impact strength/ISO 179/1eA | Notched Charpy impact strength (23°C) (when completely dry) | ISO 179/1eA | kJ/m^2 | 15 | - |
Notched Charpy impact strength (23℃) (23℃ 50%RH equilibrium water absorption) | ISO 179/1eA | kJ/m^2 | 25 | - | |
Notched Charpy impact strength (-30℃) (absolutely dry) | ISO 179/1eA | kJ/m^2 | 15 | - | |
Notched Charpy impact strength (-30℃) (23℃ 50%RH equilibrium water absorption) | ISO 179/1eA | kJ/m^2 | 8 | - | |
Charpy impact strength (23℃) (when completely dry) | ISO 179/1eU | kJ/m^2 | N | ||
Charpy impact strength (23℃) (23℃ 50% RH equilibrium water absorption) | ISO 179/1eU | kJ/m^2 | N | ||
Charpy impact strength (-30℃) (when completely dry) | ISO 179/1eU | kJ/m^2 | N | ||
Charpy impact strength (-30℃) (23℃ 50% RH equilibrium water absorption) | ISO 179/1eU | kJ/m^2 | N | ||
Surface hardness Surface hardness/ISO 868 | Hardness, durometer D (when completely dry) | ISO 868 | 83 | - | |
Yield Strain Yield Strain/ISO 527-1/-2 | Yield strain (when completely dry) | ISO 527-1/-2 | % | 6 | - |
Yield strain (at 23℃ 50% RH equilibrium water absorption) | ISO 527-1/-2 | % | 26 | - |
Blurred items can be viewed by registering or logging in.
Blurred items can be viewed by registering or logging in.
| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Volume resistivity Volume resistivity/IEC 62631-3-1 | Volume resistivity (when completely dry) | IEC 62631-3-1 | Ω・cm | NaN | - |
Volume resistivity (at 23℃ 50% RH equilibrium water absorption) | IEC 62631-3-1 | Ω・cm | NaN | - | |
Surface resistance Surface resistance/IEC 62631-3-2 | Surface resistance (23℃50%RH equilibrium water absorption) | IEC 62631-3-2 | Ω | NaN | - |
Dielectric constant Dielectric constant/IEC 62631-2-1 | Dielectric constant, 100Hz (when completely dry) | IEC 62631-2-1 | 3.4 | - | |
Dielectric constant, 100Hz (23℃ 50%RH equilibrium water absorption) | IEC 62631-2-1 | 7 | - | ||
Dielectric constant, 1MHz (when completely dry) | IEC 62631-2-1 | 3.2 | - | ||
Dielectric constant, 1MHz (23℃ 50%RH equilibrium water absorption) | IEC 62631-2-1 | 3.7 | - | ||
Dielectric loss tangent Dielectric loss tangent/IEC 62631-2-1 | Dielectric loss tangent, 100Hz (when completely dry) | IEC 62631-2-1 | E-4 | 200 | - |
Dielectric tangent, 100Hz (23℃ 50%RH equilibrium water absorption) | IEC 62631-2-1 | E-4 | 1500 | - | |
Dielectric tangent, 1MHz (when completely dry) | IEC 62631-2-1 | E-4 | 200 | - | |
Dielectric tangent, 1MHz (23℃ 50%RH equilibrium water absorption) | IEC 62631-2-1 | E-4 | 500 | - | |
Dielectric Strength Dielectric Strength/IEC 60243-1 | Withstand voltage (when completely dry) | IEC 60243-1 | kV/m m | 33.5 | - |
Tracking resistance Tracking resistance/IEC 60112 | Tracking resistance (when completely dry) | IEC 60112 | 600 | - |
Blurred items can be viewed by registering or logging in.
Blurred items can be viewed by registering or logging in.
| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/ISO 294-4,2577 | Mold shrinkage rate (parallel) (when completely dry) | ISO 294-4,2577 | % | 1.5 | - |
Mold shrinkage rate TD Mold shrinkage rate TD/ISO 294-4,2577 | Mold shrinkage rate (vertical) (when completely dry) | ISO 294-4,2577 | % | 1.5 | - |
Blurred items can be viewed by registering or logging in.
Blurred items can be viewed by registering or logging in.
| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/- | Optimum resin temperature | - | ℃ | 290 | - |
Mold Temperature Mold Temperature/- | Optimal Mold Temperature | - | ℃ | 70 | - |
Drying conditions Drying conditions/- | Drying temperature | - | ℃ | 80 | 2 - 4h |
| Key Features |
|---|
Unreinforced, impact resistant |
Copyright© 2026 PlaBase. All Rights Reserved.