Public Beta
Public Beta
| Manufacturer | Delrin Japan Co., Ltd. |
| Resin Name | POM |
| Product Name | Delrin |
| ISO Material Code | POM-Z20 |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ISO1183 | Density | ISO1183 | g/cm^3 | 1.53 | - |
Water absorption Water absorption/ISO62 | Water absorption (2mm) | ISO62 | % | 1 | - |
Water absorption (2mm) | ISO62 | % | 0.2 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ISO75-1,2 | Deflection temperature under load (1.80MPa) | ISO75-1,2 | ℃ | 92 | - |
Deflection temperature under load (0.45MPa) | ISO75-1,2 | ℃ | 160 | - | |
Linear expansion coefficient (MD) Linear expansion coefficient (MD)/ISO11359-1,2 | Linear expansion coefficient parallel | ISO11359-1,2 | x10^-5/℃ | 11 | - |
Linear expansion coefficient (TD) Linear expansion coefficient (TD)/ISO11359-1,2 | Linear expansion coefficient right angle | ISO11359-1,2 | x10^-5/℃ | 10 | - |
Flammability Flammability/IEC60695-11-10 | Flammability | IEC60695-11-10 | class | NaN | 1.5mm |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile breaking stress Tensile breaking stress/ISO527-1,2 | Breaking Stress | ISO527-1,2 | MPa | 50 | - |
Tensile strain at break Tensile strain at break/ISO527-1,2 | Breaking Strain | ISO527-1,2 | % | 10 | - |
Tensile Modulus Tensile Modulus/ISO527-1,2 | Tensile Modulus | ISO527-1,2 | MPa | 2800 | - |
Flexural modulus Flexural modulus/ISO178 | Flexural modulus | ISO178 | MPa | 2500 | - |
Charpy impact strength Charpy impact strength/ISO179/1eA | Notched Charpy impact strength (23℃) | ISO179/1eA | kJ/m^2 | 3 | - |
Notched Charpy impact strength (-30℃) | ISO179/1eA | kJ/m^2 | 3 | - | |
Charpy impact strength (23℃) | ISO179/1eU | kJ/m^2 | 40 | - | |
Charpy impact strength (-30℃) | ISO179/1eU | kJ/m^2 | 35 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Surface resistance Surface resistance/IEC60093 | Surface resistance | IEC60093 | Ω | NaN | - |
Dielectric loss tangent Dielectric loss tangent/IEC60250 | Dielectric tangent (1MHz) | IEC60250 | E-4 | 90 | - |
Tracking resistance Tracking resistance/IEC60112 | Tracking resistance | IEC60112 | 600 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/ISO 294-4, 2577 | Mold shrinkage ratio (parallel) | ISO 294-4, 2577 | % | 2 | - |
Mold shrinkage rate TD Mold shrinkage rate TD/ISO 294-4, 2577 | Mold shrinkage rate normal | ISO 294-4, 2577 | % | 1.4 | - |
ＭＦＲ ＭＦＲ/ISO1133 | Melt Mass Flow Rate | ISO1133 | g/10min | 5 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/- | Optimum resin temperature | - | ℃ | 215 | - |
Mold Temperature Mold Temperature/- | Optimal Mold Temperature | - | ℃ | 90 | - |
Drying conditions Drying conditions/- | Drying temperature | - | ℃ | 80 | 2 - 4h |
| Key Features |
|---|
Medium viscosity, 20% Teflon fiber, low friction and low wear |
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