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63000CTC | STAT-LOY COMPOUND

Manufacturer

SABIC - SHPP Japan

Resin Name

PC/polyester resin

Product Name

STAT-LOY COMPOUND

ISO Material Code

-


Basic Properties

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PropertyDetailsInspection MethodsUnitValueNote

Density

Density/ASTM D792

Density

ASTM D792

g/cm^3

1.16

-



Thermal Properties

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PropertyDetailsInspection MethodsUnitValueNote

Deflection Temperature under Load

Deflection Temperature under Load/ASTM D648

HDT (0.45 MPa, 6.4 mm, no annealing)

ASTM D648

84

-

HDT (1.82 MPa, 3.2 mm, no annealing)

ASTM D648

75

-

Linear expansion coefficient (flow)

Linear expansion coefficient (flow)/ISO 11359-2

CTE(23℃~60℃)(flow direction)

ISO 11359-2

x10^-5/℃

12

-

Linear expansion coefficient (right angle)

Linear expansion coefficient (right angle)/ISO 11359-2

CTE (23℃~60℃) (vertical direction)

ISO 11359-2

x10^-5/℃

14

-



Mechanical Properties

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PropertyDetailsInspection MethodsUnitValueNote

Tensile Yield Stress

Tensile Yield Stress/ISO 527

Tensile strength (yield point) (5mm/min)

ISO 527

MPa

34

-

Tensile strength (yield point) (Type I, 5 mm/min)

ASTM D638

MPa

35

-

Tensile strain at break

Tensile strain at break/ISO 527

Tensile elongation (break point) (5mm/min)

ISO 527

%

140

-

Tensile elongation (break point) (Type I, 10 mm/min)

SABIC Method

%

200

-

Tensile Modulus

Tensile Modulus/ISO 527

Tensile elasticity (1mm/min)

ISO 527

MPa

1190

-

Tensile elasticity (50mm/min)

ASTM D638

MPa

1170

-

Bending strength

Bending strength/ASTM D790

Flexural strength (break point) (1.3mm/min, 50mm span)

ASTM D790

MPa

52

-

Flexural modulus

Flexural modulus/ISO 178

Bending elasticity (2mm/min)

ISO 178

MPa

1150

-

Bending elasticity (1.3mm/min, 50mm span)

ASTM D790

MPa

1170

-

Charpy impact strength

Charpy impact strength/ISO 179/2C

Shalopy strength (notched, 23℃)

ISO 179/2C

kJ/m^2

69

-

Izod impact strength

Izod impact strength/ASTM D256

Izod impact strength (notched, 23℃)

ASTM D256

J/m

580

-



Electrical Properties

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PropertyDetailsInspection MethodsUnitValueNote

Surface resistance

Surface resistance/ASTM D257

Surface resistance

ASTM D257

Ω

9×10^9 ~ 4×10^11



Building Properties

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PropertyDetailsInspection MethodsUnitValueNote

Mold shrinkage rate MD

Mold shrinkage rate MD/SABIC method

Mold shrinkage rate (flow direction)

SABIC method

%

0.6

-

Mold shrinkage rate TD

Mold shrinkage rate TD/SABIC method

Mold shrinkage (vertical direction)

SABIC method

%

0.6

-



Standard Building Properties

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PropertyDetailsInspection MethodsUnitValueNote

Resin temperature

Resin temperature/

Resin temperature

-

Mold Temperature

Mold Temperature/

Mold Temperature

-

Drying conditions

Drying conditions/

Drying temperature

6-8hr



Main Applications

For semiconductor packaging applications

Key Features

Antistatic


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