Public Beta
Public Beta
| Manufacturer | SABIC - SHPP Japan |
| Resin Name | PPE/PS |
| Product Name | NORYL |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ISO 1183 | Density | ISO 1183 | g/cm^3 | 1.1 | - |
Proportion | ASTM D792 | 1.1 | - | ||
Water absorption Water absorption/ASTM D570 | Water absorption rate (24 hours) | ASTM D570 | % | 0.07 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Vicat softening temperature Vicat softening temperature/ISO 306 | Vicat softening point (Rate A/120) | ISO 306 | ℃ | 150 | - |
Vicat softening point (Rate B/120) | ISO 306 | ℃ | 140 | - | |
Deflection Temperature under Load Deflection Temperature under Load/ISO 75/Af | HDT/Af(1.8 MPa Flatw 80*10*4 sp=64mm) | ISO 75/Af | ℃ | 117 | - |
HDT (0.45 MPa, 6.4 mm, no annealing) | ASTM D648 | ℃ | 136 | - | |
HDT (1.82 MPa, 6.4 mm, no annealing) | ASTM D648 | ℃ | 122 | - | |
Linear expansion coefficient (flow) Linear expansion coefficient (flow)/ISO 11359-2 | CTE(-40℃～+40℃)(flow direction) | ISO 11359-2 | x10^-5/℃ | 8 | - |
Linear expansion coefficient (right angle) Linear expansion coefficient (right angle)/ISO 11359-2 | CTE (-40℃～+40℃)(vertical direction) | ISO 11359-2 | x10^-5/℃ | 8 | - |
Linear expansion coefficient Linear expansion coefficient/TMA | CTE(-30℃～+30℃) | TMA | x10^-5/℃ | 7 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile Yield Stress Tensile Yield Stress/ISO 527 | Tensile strength (yield point) (50mm/min) | ISO 527 | MPa | 73 | - |
Tensile strength (yield point) | SABIC Method | MPa | 63 | - | |
Tensile strain at break Tensile strain at break/ISO 527 | Tensile elongation (break point) (50mm/min) | ISO 527 | % | 8 | - |
Tensile elongation (at break) | SABIC Method | % | 8.5 | - | |
Bending strength Bending strength/ISO 178 | Bending strength (yield point) (2mm/min) | ISO 178 | MPa | 110 | - |
Bending strength | ASTM D790 | MPa | 99 | - | |
Flexural modulus Flexural modulus/ISO 178 | Bending elasticity (2mm/min) | ISO 178 | MPa | 2500 | - |
Bending Elasticity | ASTM D790 | MPa | 2350 | - | |
Charpy impact strength Charpy impact strength/ISO 179-1eU | Sharopy strength -30℃(Unnotch Edgew 80*10*4 sp=62mm) | ISO 179-1eU | kJ/m^2 | 9 | - |
Sharoppy strength 23℃ (V-notch Edgew 80*10*4 sp=62mm) | ISO 179-1eA | kJ/m^2 | 11 | - | |
Izod impact strength Izod impact strength/ISO 180/1A | Izod impact strength (notched, 80*10*4 +23℃) | ISO 180/1A | kJ/m^2 | 10 | - |
Izod impact strength (notched, 80*10*4 -30℃) | ISO 180/1A | kJ/m^2 | 6 | - | |
Izod impact strength (notched, 80*10*4 0℃) | ISO 180/1A | kJ/m^2 | 11 | - | |
Izod impact strength (notched, 80*10*4 -10℃) | ISO 180/1A | kJ/m^2 | 10 | - | |
Izod impact strength (notched, 80*10*4 -20℃) | ISO 180/1A | kJ/m^2 | 9 | - | |
Izod impact strength (notched, 80*10*4 -40℃) | ISO 180/1A | kJ/m^2 | 8 | - | |
Izod impact strength (notched, 23℃) | ASTM D256 | J/m | 140 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Surface resistance Surface resistance/ASTM D257 | Surface resistance | ASTM D257 | Ω | NaN | - |
Dielectric constant Dielectric constant/ASTM D150 | Dielectric constant, 50/60Hz | ASTM D150 | - | 2.8 | - |
Arc Resistance Arc Resistance/ASTM D495 | Arc Resistance, Tungsten (PLC) | ASTM D495 | PLC Code | 6 | 60≦D495<120 |
Tracking resistance Tracking resistance/UL 746A | CTI(Comparative Tracking Index)(UL,PLC) | UL 746A | PLC Code | 2 | 250≦CTI<400 |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/SABIC method | Mold shrinkage rate (flow direction) (3.2mm) | SABIC method | % | - | |
ＭＦＲ ＭＦＲ/ASTM D1238 | Melt flow rate (250℃/10.0kgf) | ASTM D1238 | g/10min | 3.9 | - |
ＭＶＲ ＭＶＲ/ISO 1133 | Melt volume rate (280℃/5.0kgf) | ISO 1133 | cm3/10min | 10 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Resin temperature | ℃ | - | ||
Mold Temperature Mold Temperature/ | Mold Temperature | ℃ | - | ||
Drying conditions Drying conditions/ | Drying temperature | ℃ | 3-4hr |
| Main Applications |
|---|
Printed circuit board (PCB) holders, terminal blocks, connectors |
| Key Features |
|---|
Flame retardant, electrical performance, high heat resistance, low warpage, low moisture absorption, dimensional stability |
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