Public Beta
Public Beta
| Manufacturer | SABIC - SHPP Japan |
| Resin Name | Polyetherimide |
| Product Name | EXTEM |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ISO 1183 | Density | ISO 1183 | g/cm^3 | 1.31 | - |
Proportion | ASTM D792 | 1.31 | - | ||
Water absorption Water absorption/ISO 62 | Water absorption (23℃/sat) | ISO 62 | % | 2.3 | - |
Water absorption (23℃/48h) | ASTM D570 | % | 0.6 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Vicat softening temperature Vicat softening temperature/ISO 306 | Vicat softening point (Rate B/50) | ISO 306 | ℃ | 250 | - |
Vicat softening point (Rate B/120) | ISO 306 | ℃ | 247 | - | |
Vicat softening point (Rate B/50) | ASTM D1525 | ℃ | 260 | - | |
Deflection Temperature under Load Deflection Temperature under Load/ISO 75/Af | HDT/Af(1.8 MPa Flatw 80*10*4 sp=64mm) | ISO 75/Af | ℃ | 223 | - |
HDT (0.45 MPa, 3.2 mm, no annealing) | ASTM D648 | ℃ | 250 | - | |
HDT (1.82 MPa, 3.2 mm, no annealing) | ASTM D648 | ℃ | 235 | - | |
HDT (1.82 MPa, 6.4 mm, no annealing) | ASTM D648 | ℃ | 237 | - | |
Linear expansion coefficient (flow) Linear expansion coefficient (flow)/ISO 11359-2 | CTE(23℃～150℃)(flow direction) | ISO 11359-2 | x10^-5/℃ | 5 | - |
Linear expansion coefficient (right angle) Linear expansion coefficient (right angle)/ISO 11359-2 | CTE (23℃～150℃) (vertical direction) | ISO 11359-2 | x10^-5/℃ | 5.1 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile Yield Stress Tensile Yield Stress/ISO 527 | Tensile strength (yield point) (5mm/min) | ISO 527 | MPa | 101 | - |
Tensile strength (yield point) (Type I, 5 mm/min) | ASTM D638 | MPa | 103 | - | |
Tensile breaking stress Tensile breaking stress/ISO 527 | Tensile strength (break point) (5mm/min) | ISO 527 | MPa | 74 | - |
Tensile strength (break point) (Type I, 5mm/min) | ASTEM D638 | MPa | 96 | - | |
Tensile strain at break Tensile strain at break/ISO 527 | Tensile elongation (break point) (5mm/min) | ISO 527 | % | 7 | - |
Tensile elongation (break point) (Type I, 5 mm/min) | ASTM D638 | % | 10 | - | |
Tensile Modulus Tensile Modulus/ISO 527 | Tensile elasticity (1mm/min) | ISO 527 | MPa | 3100 | - |
Tensile elasticity (5mm/min) | ASTM D638 | MPa | 3420 | - | |
Bending strength Bending strength/ISO 178 | Bending strength (yield point) (2mm/min) | ISO 178 | MPa | 120 | - |
Bending strength (yield point) (1.3mm/min, 50mm span) | ASTM D790 | MPa | 168 | - | |
Flexural modulus Flexural modulus/ISO 178 | Bending elasticity (2mm/min) | ISO 178 | MPa | 2870 | - |
Bending elasticity (1.3mm/min, 50mm span) | ASTM D790 | MPa | 3130 | - | |
Izod impact strength Izod impact strength/ISO 180/1A | Izod impact strength (notched, 80*10*4 +23℃) | ISO 180/1A | kJ/m^2 | 4 | - |
Izod impact strength (notched, 23℃) | ASTM D256 | J/m | 43 | - | |
Tensile elongation Tensile elongation/ISO 527 | Tensile elongation (yield point) (5mm/min) | ISO 527 | % | 6 | - |
Tensile elongation (yield point) (Type I, 5mm/min) | ASTM D638 | % | 7 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Dielectric Strength Dielectric Strength/ASTM D149 | Dielectric breakdown strength (in air) (1.6mm) | ASTM D149 | kV/mm | 25 | - |
Tracking resistance Tracking resistance/IEC 60112 | CTI(Comparative Tracking Index) | IEC 60112 | V | 125 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/SABIC method | Mold shrinkage rate (flow direction) (3.2mm) | SABIC method | % | - | |
ＭＦＲ ＭＦＲ/ASTM D1238 | Melt flow rate (367℃/6.6kgf) | ASTM D1238 | g/10min | 10 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Resin temperature | ℃ | - | ||
Mold Temperature Mold Temperature/ | Mold Temperature | ℃ | - | ||
Drying conditions Drying conditions/ | Drying temperature | ℃ | 175 | 4-6hr |
| Main Applications |
|---|
Electronic equipment, displays, electrical components |
| Key Features |
|---|
Flame retardant, high heat resistance |
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