| Manufacturer | Mitsui Chemicals Fine Co., Ltd. |
| Resin Name | PES |
| Product Name | MITSUI PES |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ASTM D792 | Proportion | ASTM D792 | 1.51 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ASTM D648 | Deflection temperature under load (1.82MPa) | ASTM D648 | ℃ | 220 | - |
Linear expansion coefficient (flow) Linear expansion coefficient (flow)/ASTM D696 | Coefficient of thermal expansion (MD) | ASTM D696 | ×10^-5/℃ | 2.4 | - |
Linear expansion coefficient (right angle) Linear expansion coefficient (right angle)/ASTM D696 | Coefficient of thermal expansion (TD) | ASTM D696 | ×10^-5/℃ | 5.5 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Bending strength Bending strength/ASTM D790 | Bending strength | ASTM D790 | MPa | 170 | - |
Flexural modulus Flexural modulus/ASTM D790 | Flexural modulus | ASTM D790 | MPa | 7000 | - |
Izod impact strength Izod impact strength/ASTM D256 | IZOD impact strength | ASTM D256 | J/m | 65 | - |
Tensile strength Tensile strength/ASTM D638 | Tensile strength | ASTM D638 | MPa | 125 | - |
Tensile elongation Tensile elongation/ASTM D638 | Tensile elongation | ASTM D638 | % | 3 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Surface resistance Surface resistance/ASTM D257 | Surface resistance | ASTM D257 | Ω | NaN | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage (MD) Mold shrinkage (MD)/MCI method | Mold shrinkage (MD) | MCI method | % | 0.3 | - |
Mold shrinkage (TD) Mold shrinkage (TD)/MCI method | Mold shrinkage (TD) | MCI method | % | 0.6 | - |
MFR MFR/ASTM D1238 | MFR(360℃×2.16Kgf) | ASTM D1238 | g/10min | - |
| Color |
|---|
Natural/Black |
| Main Applications |
|---|
Electrical and Electronic Components |
| Key Features |
|---|
Heat resistance, high flow |
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