| Manufacturer | Mitsui Chemicals Fine Co., Ltd. |
| Resin Name | PSU |
| Product Name | Ultrason S |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ASTM D792 | Proportion | ASTM D792 | 1.31 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ASTM D648 | Deflection temperature under load (1.82MPa) | ASTM D648 | ℃ | 183 | - |
Linear expansion coefficient Linear expansion coefficient/ASTM D696 | Thermal expansion coefficient | ASTM D696 | ×10^-5/℃ | 4.5 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Bending strength Bending strength/ASTM D790 | Bending strength | ASTM D790 | MPa | 140 | - |
Flexural modulus Flexural modulus/ASTM D791 | Flexural modulus | ASTM D791 | MPa | 4000 | - |
Izod impact strength Izod impact strength/ASTM D256 | IZOD impact strength | ASTM D256 | J/m | 50 | - |
Tensile strength Tensile strength/ASTM D639 | Tensile strength | ASTM D639 | MPa | 85 | - |
Tensile elongation Tensile elongation/ASTM D638 | Tensile elongation | ASTM D638 | % | 3 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage (MD) Mold shrinkage (MD)/MCI method | Mold shrinkage (MD) | MCI method | % | 0.5 | - |
Mold shrinkage (TD) Mold shrinkage (TD)/MCI method | Mold shrinkage (TD) | MCI method | % | 0.7 | - |
MFR MFR/ASTM D1238 | MFR(360℃×2.16Kgf) | ASTM D1238 | g/10min | 10 | - |
| Color |
|---|
Black |
| Main Applications |
|---|
Electrical and Electronic Components |
| Key Features |
|---|
Heat resistance |
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