| Manufacturer | SABIC - SHPP Japan |
| Resin Name | PC resin |
| Product Name | LNP THERMOCOMP COMPOUND |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ISO 1183 | Density | ISO 1183 | g/cm^3 | 2.5 | - |
Water absorption Water absorption/ISO 62-1 | Water absorption rate (23℃/24 hours) | ISO 62-1 | % | 0.08 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ISO 75/Af | HDT/Af(1.8 MPa Flatw 80*10*4 sp=64mm) | ISO 75/Af | ℃ | 60 | - |
HDT/Bf(0.45 Mpa Flatw 80*10*4 sp=64mm) | ISO 75/Bf | ℃ | 100 | - | |
Linear expansion coefficient (flow) Linear expansion coefficient (flow)/ISO 11359-2 | CTE(23℃~60℃)(flow direction) | ISO 11359-2 | x10^-5/℃ | 13 | - |
Linear expansion coefficient (right angle) Linear expansion coefficient (right angle)/ISO 11359-2 | CTE (23℃~60℃) (vertical direction) | ISO 11359-2 | x10^-5/℃ | 15 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile breaking stress Tensile breaking stress/ISO 527 | Tensile strength (break point) (5mm/min) | ISO 527 | MPa | 20 | - |
Tensile strain at break Tensile strain at break/ISO 527 | Tensile elongation (break point) (5mm/min) | ISO 527 | % | 1.2 | - |
Tensile Modulus Tensile Modulus/ISO 527 | Tensile elasticity (1mm/min) | ISO 527 | MPa | 2550 | - |
Bending strength Bending strength/ISO 178 | Bending strength (break point) (2mm/min) | ISO 178 | MPa | 15 | - |
Flexural modulus Flexural modulus/ISO 178 | Bending elasticity (2mm/min) | ISO 178 | MPa | 2750 | - |
Izod impact strength Izod impact strength/ISO 180/1A | Izod impact strength (notched, 80*10*4 +23℃) | ISO 180/1A | kJ/m^2 | 3.5 | - |
Izod impact strength (unnotched, 80*10*4 +23℃) | ISO 180/1U | kJ/m^2 | 5.5 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Refractive index Refractive index/IEC 60250 | Refractive index, 1GHz | IEC 60250 | 13.1 | - | |
Refractive index, 500MHz | IEC 60250 | 13.4 | - | ||
Refractive index, 100MHz | IEC 60250 | 13.6 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/SABIC method | Mold shrinkage rate (flow direction) | SABIC method | % | - | |
MVR MVR/ISO 1133 | Melt volume rate (220℃/10.0kg) | ISO 1133 | cm3/10min | 12.5 | - |
Melt volume rate (190℃/10.0kg) | ISO 1133 | cm3/10min | 7.5 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Resin temperature | ℃ | - | ||
Mold Temperature Mold Temperature/ | Mold Temperature | ℃ | - | ||
Drying conditions Drying conditions/ | Drying temperature | ℃ | 80 | 4hrs |
| Color |
|---|
Natural |
| Main Applications |
|---|
RFID substrates, antenna applications, infrastructure equipment, applications requiring dielectric constant control |
| Key Features |
|---|
High rigidity and high toughness |
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