Public Beta
Public Beta
| Manufacturer | SABIC - SHPP Japan |
| Resin Name | PC resin |
| Product Name | LNP THERMOCOMP COMPOUND |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ISO 1183 | Density | ISO 1183 | g/cm^3 | 1.21 | - |
Water absorption Water absorption/ISO 62-1 | Water absorption rate (23℃/24 hours) | ISO 62-1 | % | 0.05 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ISO 75/Af | HDT/Af(1.8 MPa Flatw 80*10*4 sp=64mm) | ISO 75/Af | ℃ | 155 | - |
HDT/Bf(0.45 Mpa Flatw 80*10*4 sp=64mm) | ISO 75/Bf | ℃ | 175 | - | |
HDT (0.45 MPa, 3.2 mm, no annealing) | ASTM D648 | ℃ | 174 | - | |
HDT (1.82 MPa, 3.2 mm, no annealing) | ASTM D648 | ℃ | 154 | - | |
Linear expansion coefficient (flow) Linear expansion coefficient (flow)/ASTM E831 | CTE (-40℃～150℃) (flow direction) | ASTM E831 | x10^-5/℃ | 6.5 | - |
Linear expansion coefficient (right angle) Linear expansion coefficient (right angle)/ASTM E831 | CTE(-40℃～150℃)(vertical direction) | ASTM E831 | x10^-5/℃ | 9.4 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile Yield Stress Tensile Yield Stress/ISO 527 | Tensile strength (yield point) (50mm/min) | ISO 527 | MPa | 57 | - |
Tensile strength (yield point) (Type I, 50 mm/min) | ASTM D638 | MPa | 58 | - | |
Tensile breaking stress Tensile breaking stress/ISO 527 | Tensile strength (break point) (50mm/min) | ISO 527 | MPa | 49 | - |
Tensile strength (break point) (Type I, 50 mm/min) | ASTEM D638 | MPa | 51 | - | |
Tensile strain at break Tensile strain at break/ISO 527 | Tensile elongation (break point) (50mm/min) | ISO 527 | % | 33 | - |
Tensile elongation (break point) (Type I, 50 mm/min) | ASTM D638 | % | 34 | - | |
Tensile Modulus Tensile Modulus/ISO 527 | Tensile elasticity (1mm/min) | ISO 527 | MPa | 2240 | - |
Tensile elasticity (50mm/min) | ASTM D638 | MPa | 2290 | - | |
Bending strength Bending strength/ISO 178 | Bending strength (break point) (2mm/min) | ISO 178 | MPa | 91 | - |
Bending strength (yield point) (2mm/min) | ISO 178 | MPa | 93 | - | |
Flexural strength (break point) (1.3mm/min, 50mm span) | ASTM D790 | MPa | 84 | - | |
Bending strength (yield point) (1.3mm/min, 50mm span) | ASTM D790 | MPa | 86 | - | |
Flexural modulus Flexural modulus/ISO 178 | Bending elasticity (2mm/min) | ISO 178 | MPa | 2210 | - |
Bending elasticity (1.3mm/min, 50mm span) | ASTM D790 | MPa | 2080 | - | |
Izod impact strength Izod impact strength/ISO 180/1A | Izod impact strength (notched, 80*10*4 +23℃) | ISO 180/1A | kJ/m^2 | 55 | - |
Izod impact strength (notched, 80*10*4 -20℃) | ISO 180/1A | kJ/m^2 | 13 | - | |
Izod impact strength (notched, 23℃) | ASTM D256 | J/m | 720 | - | |
Izod impact strength (notched, -20℃) | ASTM D256 | J/m | 135 | - | |
Tensile elongation Tensile elongation/ISO 527 | Tensile elongation (yield point) (50mm/min) | ISO 527 | % | 8.9 | - |
Tensile elongation (yield point) (Type I, 50 mm/min) | ASTM D638 | % | 9 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Dielectric constant Dielectric constant/SABIC method | Dielectric constant, 1.1GHz | SABIC method | 3.04 | - | |
Dielectric constant, 1.9GHz | SABIC method | 3.05 | - | ||
Dielectric constant, 5GHz | SABIC method | 3.06 | - | ||
Dielectric constant, 10GHz | SABIC method | 3.06 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/SABIC method | Mold shrinkage rate (flow direction) | SABIC method | % | - | |
Mold shrinkage rate TD Mold shrinkage rate TD/SABIC method | Mold shrinkage (vertical direction) | SABIC method | % | - | |
ＭＦＲ ＭＦＲ/ASTM D1238 | Melt flow rate (300℃/5.0kgf) | ASTM D1238 | g/10min | 11 | - |
Melt flow rate (300℃/10kgf) | ASTM D1238 | g/10min | 33 | - | |
ＭＶＲ ＭＶＲ/ISO 1133 | Melt volume rate (300℃/5.0kg) | ISO 1133 | cm3/10min | 10 | - |
Melt volume rate (300℃/10.0kg) | ISO 1133 | cm3/10min | 31 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Resin temperature | ℃ | - | ||
Mold Temperature Mold Temperature/ | Mold Temperature | ℃ | - | ||
Drying conditions Drying conditions/ | Drying temperature | ℃ | 105 | 3-5hr |
| Color |
|---|
Natural |
| Main Applications |
|---|
RFID substrates, antenna applications, infrastructure equipment, applications requiring dielectric constant control |
| Key Features |
|---|
High rigidity and high toughness |
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