Public Beta
Public Beta
| Manufacturer | SABIC - SHPP Japan |
| Resin Name | PC resin |
| Product Name | LNP THERMOCOMP COMPOUND |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ISO 1183 | Density | ISO 1183 | g/cm^3 | 1.66 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ASTM D648 | HDT (0.45 MPa, 3.2 mm, no annealing) | ASTM D648 | ℃ | 134 | - |
HDT (1.82 MPa, 3.2 mm, no annealing) | ASTM D648 | ℃ | 122 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Bending strength Bending strength/ASTM D790 | Flexural strength (break point) (1.3mm/min, 50mm span) | ASTM D790 | MPa | - | |
Flexural modulus Flexural modulus/ISO 178 | Bending elasticity (2mm/min) | ISO 178 | MPa | 3350 | 3200-3500 |
Izod impact strength Izod impact strength/ASTM D256 | Izod impact strength (notched, 23℃) | ASTM D256 | J/m | 60 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Dielectric constant Dielectric constant/ASTM ES 7-83 | Dielectric constant (Dk), 1.1GHz | ASTM ES 7-83 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/ASTM D955 | Mold shrinkage rate (flow direction) (24 hours) | ASTM D955 | % | 0.7 | - |
Mold shrinkage rate TD Mold shrinkage rate TD/ASTM D955 | Mold shrinkage (vertical direction) (24 hours) | ASTM D955 | % | 0.65 | - |
ＭＶＲ ＭＶＲ/ISO 1133 | Melt volume rate (300℃/5.0kg) | ISO 1133 | cm3/10min | 11 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Resin temperature | ℃ | - | ||
Mold Temperature Mold Temperature/ | Mold Temperature | ℃ | 90 | - | |
Drying conditions Drying conditions/ | Drying temperature | ℃ | 105 | 3-5hr |
| Color |
|---|
Natural |
| Main Applications |
|---|
RFID substrates, antenna applications, infrastructure equipment, applications requiring dielectric constant control |
| Key Features |
|---|
High rigidity and high toughness |
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