| Manufacturer | SABIC - SHPP Japan |
| Resin Name | PC resin |
| Product Name | LNP THERMOCOMP COMPOUND |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ASTM D792 | Proportion | ASTM D792 | 2.24 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ASTM D648 | HDT (1.82 MPa, 3.2 mm, no annealing) | ASTM D648 | ℃ | 97 | - |
HDT (1.82 MPa, 6.4 mm, no annealing) | ASTM D648 | ℃ | 103 | - | |
Linear expansion coefficient (flow) Linear expansion coefficient (flow)/ASTM E831 | CTE (-40℃~40℃) (flow direction) | ASTM E831 | x10^-5/℃ | 6.2 | - |
Linear expansion coefficient (right angle) Linear expansion coefficient (right angle)/ASTM E831 | CTE(-40℃~40℃)(vertical direction) | ASTM E831 | x10^-5/℃ | 6.4 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile breaking stress Tensile breaking stress/ASTEM D638 | Tensile strength (break point) (Type I, 5mm/min) | ASTEM D638 | MPa | 27 | - |
Tensile strain at break Tensile strain at break/ASTM D638 | Tensile elongation (break point) (Type I, 5 mm/min) | ASTM D638 | % | 4.2 | - |
Bending strength Bending strength/ASTM D790 | Bending strength | ASTM D790 | MPa | 60 | - |
Flexural modulus Flexural modulus/ASTM D790 | Bending Elasticity | ASTM D790 | MPa | 2490 | - |
Izod impact strength Izod impact strength/ASTM D256 | Izod impact strength (notched, 23℃) | ASTM D256 | J/m | 68 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Dielectric constant Dielectric constant/SABIC method | Dielectric constant, 1.1GHz | SABIC method | 8 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/SABIC method | Mold shrinkage rate (flow direction) 3.2mm | SABIC method | % | 0.65 | - |
Mold shrinkage rate TD Mold shrinkage rate TD/SABIC method | Molding shrinkage rate (vertical direction) 3.2mm | SABIC method | % | 0.56 | - |
MVR MVR/ASTM D1238 | Melt volume rate (280℃/2.16kg) | ASTM D1238 | cm3/10min | 15.7 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Resin temperature | ℃ | - | ||
Mold Temperature Mold Temperature/ | Mold Temperature | ℃ | - | ||
Drying conditions Drying conditions/ | Drying temperature | ℃ | 3-5hr |
| Color |
|---|
Natural |
| Main Applications |
|---|
RFID substrates, antenna applications, infrastructure equipment, applications requiring dielectric constant control |
| Key Features |
|---|
High rigidity and high toughness |
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