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DX09309 | LNP THERMOCOMP COMPOUND

Manufacturer

SABIC - SHPP Japan

Resin Name

PC resin

Product Name

LNP THERMOCOMP COMPOUND

ISO Material Code

-


Basic Properties

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PropertyDetailsInspection MethodsUnitValueNote

Density

Density/ASTM D792

Proportion

ASTM D792

2.24

-



Thermal Properties

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PropertyDetailsInspection MethodsUnitValueNote

Deflection Temperature under Load

Deflection Temperature under Load/ASTM D648

HDT (1.82 MPa, 3.2 mm, no annealing)

ASTM D648

97

-

HDT (1.82 MPa, 6.4 mm, no annealing)

ASTM D648

103

-

Linear expansion coefficient (flow)

Linear expansion coefficient (flow)/ASTM E831

CTE (-40℃~40℃) (flow direction)

ASTM E831

x10^-5/℃

6.2

-

Linear expansion coefficient (right angle)

Linear expansion coefficient (right angle)/ASTM E831

CTE(-40℃~40℃)(vertical direction)

ASTM E831

x10^-5/℃

6.4

-



Mechanical Properties

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PropertyDetailsInspection MethodsUnitValueNote

Tensile breaking stress

Tensile breaking stress/ASTEM D638

Tensile strength (break point) (Type I, 5mm/min)

ASTEM D638

MPa

27

-

Tensile strain at break

Tensile strain at break/ASTM D638

Tensile elongation (break point) (Type I, 5 mm/min)

ASTM D638

%

4.2

-

Bending strength

Bending strength/ASTM D790

Bending strength

ASTM D790

MPa

60

-

Flexural modulus

Flexural modulus/ASTM D790

Bending Elasticity

ASTM D790

MPa

2490

-

Izod impact strength

Izod impact strength/ASTM D256

Izod impact strength (notched, 23℃)

ASTM D256

J/m

68

-



Electrical Properties

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PropertyDetailsInspection MethodsUnitValueNote

Dielectric constant

Dielectric constant/SABIC method

Dielectric constant, 1.1GHz

SABIC method

8

-



Building Properties

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PropertyDetailsInspection MethodsUnitValueNote

Mold shrinkage rate MD

Mold shrinkage rate MD/SABIC method

Mold shrinkage rate (flow direction) 3.2mm

SABIC method

%

0.65

-

Mold shrinkage rate TD

Mold shrinkage rate TD/SABIC method

Molding shrinkage rate (vertical direction) 3.2mm

SABIC method

%

0.56

-

MVR

MVR/ASTM D1238

Melt volume rate (280℃/2.16kg)

ASTM D1238

cm3/10min

15.7

-



Standard Building Properties

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PropertyDetailsInspection MethodsUnitValueNote

Resin temperature

Resin temperature/

Resin temperature

-

Mold Temperature

Mold Temperature/

Mold Temperature

-

Drying conditions

Drying conditions/

Drying temperature

3-5hr



Color

Natural

Main Applications

RFID substrates, antenna applications, infrastructure equipment, applications requiring dielectric constant control

Key Features

High rigidity and high toughness


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