Public Beta
Public Beta
| Manufacturer | SABIC - SHPP Japan |
| Resin Name | PC resin |
| Product Name | LNP THERMOCOMP COMPOUND |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ASTM D792 | Density | ASTM D792 | g/cm^3 | 2.14 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ASTM D648 | HDT (1.82 MPa, 3.2 mm, no annealing) | ASTM D648 | ℃ | 265 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile breaking stress Tensile breaking stress/ASTEM D638 | Tensile strength (break point) (Type I, 5mm/min) | ASTEM D638 | MPa | 125 | - |
Tensile strain at break Tensile strain at break/ASTM D638 | Tensile elongation (break point) (Type I, 5 mm/min) | ASTM D638 | % | 1.4 | - |
Tensile Modulus Tensile Modulus/ASTM D638 | Tensile elasticity (5mm/min) | ASTM D638 | MPa | 13784 | - |
Bending strength Bending strength/ASTM D790 | Bending strength (yield point) (1.3mm/min, 50mm span) | ASTM D790 | MPa | 185 | - |
Flexural modulus Flexural modulus/ASTM D790 | Bending elasticity (1.3mm/min, 50mm span) | ASTM D790 | MPa | 11500 | - |
Izod impact strength Izod impact strength/ASTM D256 | Izod impact strength (notched, 23℃) | ASTM D256 | J/m | 40 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Dielectric constant Dielectric constant/SABIC method | Dielectric constant, 1.9GHz | SABIC method | 6.2 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/SABIC method | Mold shrinkage rate (flow direction) | SABIC method | % | 0.33 | - |
Mold shrinkage rate TD Mold shrinkage rate TD/SABIC method | Mold shrinkage (vertical direction) | SABIC method | % | 0.35 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Resin temperature | ℃ | - | ||
Mold Temperature Mold Temperature/ | Mold Temperature | ℃ | - | ||
Drying conditions Drying conditions/ | Drying temperature | ℃ | 4-6hr |
| Color |
|---|
Natural |
| Main Applications |
|---|
RFID substrates, antenna applications, infrastructure equipment, applications requiring dielectric constant control |
| Key Features |
|---|
High rigidity and high toughness |
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