| Manufacturer | Celanese Corporation |
| Resin Name | PA6 |
| Product Name | Zytel |
| ISO Material Code | PA6-(MD+GF)63FR(61) |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ISO 1183 | Density (dry) | ISO 1183 | g/cm^3 | 1.66 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ISO 75-1/-2 | Deflection temperature under load (1.80 MPa) (when completely dry) | ISO 75-1/-2 | ℃ | 175 | - |
Deflection temperature under load (0.45 MPa) (when completely dry) | ISO 75-1/-2 | ℃ | 210 | - | |
Melting point Melting point/ISO 11357-1/-3 | Melting temperature (10℃/min) (when completely dry) | ISO 11357-1/-3 | ℃ | 220 | - |
Glass transition temperature Glass transition temperature/ISO 11357-1/-3 | Glass transition temperature (10℃/min) (when completely dry) | ISO 11357-1/-3 | ℃ | 65 | - |
Glass transition temperature (10℃/min) (at 23℃ 50% RH equilibrium water absorption) | ISO 11357-1/-3 | ℃ | 15 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile breaking stress Tensile breaking stress/ISO 527-1/-2 | Breaking stress (when completely dry) | ISO 527-1/-2 | MPa | 90 | - |
Tensile Modulus Tensile Modulus/ISO 527-1/-2 | Tensile modulus (when completely dry) | ISO 527-1/-2 | MPa | 10000 | - |
Bending strength Bending strength/ISO 178 | Bending strength (when completely dry) | ISO 178 | MPa | 130 | - |
Flexural modulus Flexural modulus/ISO 178 | Flexural modulus (when completely dry) | ISO 178 | MPa | 9100 | - |
Charpy impact strength Charpy impact strength/ISO 179/1eA | Notched Charpy impact strength (23°C) (when completely dry) | ISO 179/1eA | kJ/m^2 | 2 | - |
Charpy impact strength (23℃) (when completely dry) | ISO 179/1eU | kJ/m^2 | 18 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Volume resistivity Volume resistivity/IEC 62631-3-1 | Volume resistivity (when completely dry) | IEC 62631-3-1 | Ω・cm | NaN | - |
Tracking resistance Tracking resistance/IEC 60112 | Tracking resistance (when completely dry) | IEC 60112 | 600 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/ISO 294-4,2577 | Mold shrinkage rate (parallel) (when completely dry) | ISO 294-4,2577 | % | 0.4 | - |
Mold shrinkage rate TD Mold shrinkage rate TD/ISO 294-4,2577 | Mold shrinkage rate (vertical) (when completely dry) | ISO 294-4,2577 | % | 0.5 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Optimum resin temperature | ℃ | 285 | - | |
Mold Temperature Mold Temperature/ | Optimal Mold Temperature | ℃ | 100 | - | |
Drying conditions Drying conditions/ | Drying temperature | ℃ | 2 - 4h |
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