| Manufacturer | Celanese Corporation |
| Resin Name | PA66 |
| Product Name | Zytel |
| ISO Material Code | PA66-HI |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ISO 1183 | Density (dry) | ISO 1183 | g/cm^3 | 1.08 | - |
Water absorption Water absorption/ISO 62 | Equilibrium water absorption (2mm) (when absorbing moisture) | ISO 62 | % | 2 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ISO 75-1/-2 | Deflection temperature under load (1.80 MPa) (when completely dry) | ISO 75-1/-2 | ℃ | 63 | - |
Deflection temperature under load (0.45 MPa) (when completely dry) | ISO 75-1/-2 | ℃ | 167 | - | |
Melting point Melting point/ISO 11357-1/-3 | Melting temperature (10℃/min) (when completely dry) | ISO 11357-1/-3 | ℃ | 262 | - |
Flammability Flammability/IEC 60695-11-10 | Flammability | IEC 60695-11-10 | class | NaN | 1.5mm |
Glass transition temperature Glass transition temperature/ISO 11357-1/-3 | Glass transition temperature (10℃/min) (when completely dry) | ISO 11357-1/-3 | ℃ | 75 | - |
Glass transition temperature (10℃/min) (at 23℃ 50% RH equilibrium water absorption) | ISO 11357-1/-3 | ℃ | 20 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile Yield Stress Tensile Yield Stress/ISO 527-1/-2 | Yield stress (absolutely dry) | ISO 527-1/-2 | MPa | 52 | - |
Tensile strain at break Tensile strain at break/ISO 527-1/-2 | Breaking strain (when completely dry) | ISO 527-1/-2 | % | 40 | - |
Tensile Modulus Tensile Modulus/ISO 527-1/-2 | Tensile modulus (when completely dry) | ISO 527-1/-2 | MPa | 1900 | - |
Flexural modulus Flexural modulus/ISO 178 | Flexural modulus (when completely dry) | ISO 178 | MPa | 1900 | - |
Flexural modulus (at 23℃ 50% RH equilibrium water absorption) | ISO 178 | MPa | 800 | - | |
Charpy impact strength Charpy impact strength/ISO 179/1eA | Notched Charpy impact strength (23°C) (when completely dry) | ISO 179/1eA | kJ/m^2 | 80 | - |
Notched Charpy impact strength (-40℃) (absolutely dry) | ISO 179/1eA | kJ/m^2 | 17 | - | |
Charpy impact strength (23℃) (23℃ 50% RH equilibrium water absorption) | ISO 179/1eU | kJ/m^2 | N | ||
Yield Strain Yield Strain/ISO 527-1/-2 | Yield strain (when completely dry) | ISO 527-1/-2 | % | 5 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Dielectric Strength Dielectric Strength/IEC 60243-1 | Withstand voltage (when completely dry) | IEC 60243-1 | kV/m m | 31 | - |
Tracking resistance Tracking resistance/IEC 60112 | Tracking resistance (when completely dry) | IEC 60112 | 600 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/ISO 294-4,2577 | Mold shrinkage rate (parallel) (when completely dry) | ISO 294-4,2577 | 1.8 | - | |
Mold shrinkage rate TD Mold shrinkage rate TD/ISO 294-4,2577 | Mold shrinkage rate (vertical) (when completely dry) | ISO 294-4,2577 | % | 1.4 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Optimum resin temperature | ℃ | 290 | - | |
Mold Temperature Mold Temperature/ | Optimal Mold Temperature | ℃ | 80 | - | |
Drying conditions Drying conditions/ | Drying temperature | ℃ | 80 | 2 - 4h |
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