| Manufacturer | Mitsubishi Chemical Corporation |
| Resin Name | PC FR |
| Product Name | XANTAR |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ISO 1183 | Density | ISO 1183 | g/cm3 | 1.26 | - |
Water absorption Water absorption/Sim. to ISO 62 | Sim. to ISO 62 | % | 0.35 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Vicat softening temperature Vicat softening temperature/ISO 306 | Vicat softening temperature (50℃/h 50N) | ISO 306 | ℃ | 144 | - |
Deflection Temperature under Load Deflection Temperature under Load/ISO 75-1/-2 | Deflection temperature under load (1.8MPa) | ISO 75-1/-2 | ℃ | 122 | - |
Linear expansion coefficient (flow) Linear expansion coefficient (flow)/ISO 11359-1/-2 | Linear expansion coefficient (flow direction) | ISO 11359-1/-2 | x10^-5/℃ | 6 | - |
Linear expansion coefficient (right angle) Linear expansion coefficient (right angle)/ISO 11359-1/-2 | Linear expansion coefficient (vertical direction) | ISO 11359-1/-2 | x10^-5/℃ | 6.5 | - |
Flammability Flammability/IEC 60695-11-10 | Flammability at 1.5mm thickness | IEC 60695-11-10 | class | NaN | - |
Flammability at thickness h | IEC 60695-11-10 | class | NaN | 0.5mm | |
Flammability at thickness h 5V | IEC 60695-11-20 | class | NaN | 3mm |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile Yield Stress Tensile Yield Stress/ISO 527-1/-2 | Yield Stress | ISO 527-1/-2 | MPa | 52 | - |
Tensile strain at break Tensile strain at break/ISO 527-1/-2 | Nominal breaking strain | ISO 527-1/-2 | % | 50 | - |
Tensile Modulus Tensile Modulus/ISO 527-1/-2 | Tensile Modulus | ISO 527-1/-2 | MPa | 2200 | - |
Bending strength Bending strength/ISO 178 | Bending strength | ISO 178 | MPa | 80 | - |
Flexural modulus Flexural modulus/ISO 178 | Flexural modulus | ISO 178 | MPa | 2300 | - |
Charpy impact strength Charpy impact strength/ISO 179/1eU | Charpy impact strength (23℃) | ISO 179/1eU | kJ/m^2 | N | |
Charpy impact strength (-30℃) | ISO 179/1eU | kJ/m^2 | N | ||
Charpy impact strength notched (23℃) | ISO 179/1eU | kJ/m^2 | 55 | - | |
Charpy impact strength notched (-30℃) | ISO 179/1eU | kJ/m^2 | 30 | - | |
Izod impact strength Izod impact strength/ISO 180/4A | Izod impact strength notched (23°C) | ISO 180/4A | KJ/m^2 | 60 | - |
Izod impact strength notched (-20℃) | ISO 180/4A | KJ/m^2 | 40 | - | |
Yield Strain Yield Strain/ISO 527-1/-2 | Yield Strain | ISO 527-1/-2 | % | 5 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Volume resistivity Volume resistivity/IEC 60093 | Volume resistivity | IEC 60093 | Ω・cm | NaN | - |
Surface resistance Surface resistance/IEC 60093 | Surface resistance | IEC 60093 | Ω | NaN | - |
Dielectric constant Dielectric constant/ASTM D2520 | Dielectric constant (DK, 1GHz) | ASTM D2520 | - | 2.9 | - |
Dielectric constant (DK, 2.5GHz) | ASTM D2520 | - | 2.9 | - | |
Dielectric constant (DK, 6GHz) | ASTM D2520 | - | 2.9 | - | |
Dielectric loss tangent Dielectric loss tangent/ASTM D2520 | Dissipation factor (DF, 1GHz) | ASTM D2520 | 0.007 | - | |
Dielectric loss tangent (DK, 2.5GHz) | ASTM D2520 | 0.006 | - | ||
Dissipation factor (DF, 6GHz) | ASTM D2520 | 0.006 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/ISO 294-4 | Mold shrinkage (machine direction) | ISO 294-4 | % | 0.5 | - |
MVR MVR/ISO 1133 | Melt volume flow rate (260℃, 5kg) | ISO 1133 | cm3/10min | 10 | - |
| Key Features |
|---|
Flame retardant (halogen free), black only, Laser Discharge Circuit Formation (LDS) |
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