Density

ISO1183

g/cm^3

-

Proportion

ASTMD792

-

Specific heat

-

J/(kg・℃)

-

Deflection temperature under load (load 1.8 MPa)

ISO75

℃

-

Deflection temperature under load (load 0.45 MPa)

ISO75

℃

-

Deflection temperature under load (load 1.82 MPa)

ASTMD648

℃

-

Deflection temperature under load (load 0.46 MPa)

ASTMD648

℃

-

Linear expansion coefficient

ASTMD 696

×10^-5/℃

-

Thermal Conductivity

-

W/(m･℃)

-

Tensile yield stress (23℃ 50% RH)

ISO527

MPa

-

Tensile yield strain (23℃ 50% RH)

ISO528

%

-

Tensile modulus (Young's modulus, 23℃ 50% RH)

ISO527

MPa

-

Bending strength (23℃ 50% RH)

ISO178

MPa

-

Bending strength

ASTMD790

MPa

-

Flexural modulus (23℃)

ISO178

MPa

-

Flexural modulus

ASTMD790

MPa

-

Charpy impact strength (unnotched)

ISO179

KJ/m^2

NB

Charpy impact strength (notched)

ISO179

KJ/m^2

-

Izod impact value (23℃ 1/4 inch notched)

ASTMD256

J/m

-

Rockwell hardness (R scale)

ISO2039

R

-

Rockwell hardness (M scale)

ISO2039

M

-

Rockwell hardness (R scale)

ASTMD785

R

-

Rockwell hardness (M scale)

ASTMD785

M

-

Tensile strength

ASTMD638

MPa

-

Tensile elongation

ASTMD638

%

-

Volume resistivity (23℃ 50% RH)

IEC 60093

Ω・cm

-

Volume resistivity (23℃ 50% RH)

ASTMD257

Ω・cm

-

Surface resistance (23℃50%RH)

IEC 60093

Ω

-

Surface resistance (23℃ 50% RH)

ASTMD257

Ω

-

Dielectric Breakdown Strength

IEC 60243

kV/mm

-

Dielectric breakdown strength (short time 2mm)

ASTMD149

kV/mm

-

Mold shrinkage (flow direction/transverse direction)

Asahi Kasei Process

%

-

Molding shrinkage (flow direction/right angle direction) (3mm)

Asahi Kasei Process

%

-