| Manufacturer | Polypla Evonik Co., Ltd. |
| Resin Name | TPE |
| Product Name | DAIAMID |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ISO1183 | Density | ISO1183 | g/cm^3 | 1.01 | 23℃ |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile Yield Stress Tensile Yield Stress/ISO527 | Tensile Yield Strength | ISO527 | MPa | 26 | 23℃,50%RH |
Tensile breaking stress Tensile breaking stress/ISO527 | Tensile Break Strength | ISO527 | MPa | 40 | 23℃,50%RH |
Tensile strain at break Tensile strain at break/ISO527 | Tensile elongation at break | ISO527 | % | 100 | 23℃,50%RH |
Tensile Modulus Tensile Modulus/ISO527 | Tensile Modulus | ISO527 | MPa | 440 | 23℃,50%RH |
Flexural modulus Flexural modulus/ISO178 | Flexural modulus | ISO178 | MPa | 380 | 23℃,50%RH |
Charpy impact strength Charpy impact strength/ISO179/1eA | Charpy impact strength (notched at 23°C) | ISO179/1eA | kJ/m^2 | NB | |
Charpy impact strength (notched -30℃) | ISO179/1eA | kJ/m^2 | 10 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Resin temperature | ℃ | - | ||
Mold Temperature Mold Temperature/- | Mold Temperature | - | ℃ | 50 | - |
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