| Manufacturer | Solvay Specialty Polymers Japan Co., Ltd. |
| Resin Name | PEEK |
| Product Name | KetaSpire |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ASTMD792 | Proportion | ASTMD792 | 1.3 | - | |
Water absorption Water absorption/ASTMD570 | Water absorption rate (24hr) | ASTMD570 | % | 0.1 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Specific heat Specific heat/DSC | Specific heat (50℃) | DSC | J/kg・℃ | 1330 | - |
Specific heat (200℃) | DSC | J/kg・℃ | 1930 | - | |
Deflection Temperature under Load Deflection Temperature under Load/ASTMD648 | Deflection temperature under load (1.8MPa, annealed) | ASTMD648 | ℃ | 160 | - |
Linear expansion coefficient (flow) Linear expansion coefficient (flow)/ASTME831 | Linear expansion coefficient (flow, -50 to 50℃) | ASTME831 | ×10^-5/℃ | 5 | - |
Thermal Conductivity Thermal Conductivity/ASTME1530 | Thermal Conductivity | ASTME1530 | W/m・℃ | 0.25 | - |
Melting point Melting point/ASTMD3418 | Melting point | ASTMD3418 | ℃ | 343 | - |
Glass transition temperature Glass transition temperature/ASTMD3418 | Glass transition temperature | ASTMD3418 | ℃ | 147 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile Yield Stress Tensile Yield Stress/ISO527-2/1A/50 | Tensile Yield Stress | ISO527-2/1A/50 | MPa | 102 | - |
Tensile strain at break Tensile strain at break/ISO527-2/1A/50 | Tensile elongation at break | ISO527-2/1A/50 | % | - | |
Tensile elongation at break (50mm/min) | ASTMD638 | % | - | ||
Tensile Modulus Tensile Modulus/ISO527-2/1A/1 | Tensile Modulus | ISO527-2/1A/1 | MPa | 4000 | - |
Tensile modulus (1.0mm/min) | ASTMD638 | MPa | 3700 | - | |
Bending strength Bending strength/ISO178 | Bending strength | ISO178 | MPa | 134 | - |
Bending strength | ASTMD790 | MPa | 153 | - | |
Flexural modulus Flexural modulus/ISO178 | Flexural modulus | ISO178 | MPa | 3900 | - |
Flexural modulus | ASTMD790 | MPa | 3800 | - | |
Izod impact strength Izod impact strength/ISO180 | Izod impact strength (unnotched) | ISO180 | kJ/m^2 | No Break | |
Izod impact strength (notched) | ISO180 | kJ/m^2 | 4.9 | - | |
Izod impact strength (unnotched) | ASTMD4812 | J/m | No Break | ||
Izod impact strength (notched) | ASTMD256 | J/m | 53 | - | |
Surface hardness Surface hardness/ASTMD785 | Rockwell hardness (M scale) | ASTMD785 | M | 102 | - |
Tensile strength Tensile strength/ASTMD638 | Tensile stress (51mm/min) | ASTMD638 | MPa | 100 | - |
Tensile elongation Tensile elongation/ISO527-2/1A/50 | Tensile Yield Elongation | ISO527-2/1A/50 | % | 5 | - |
Tensile yield elongation (50mm/min) | ASTMD638 | % | 5.2 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Volume resistivity Volume resistivity/ASTMD257 | Volume resistivity | ASTMD257 | Ω・cm | NaN | - |
Surface resistance Surface resistance/ASTMD257 | Surface resistance | ASTMD257 | Ω | NaN | - |
Dielectric constant Dielectric constant/ASTMD150 | Dielectric constant (60Hz) | ASTMD150 | 3.1 | - | |
Dielectric constant (1kHz) | ASTMD150 | 3.01 | - | ||
Dielectric constant (1MHz) | ASTMD150 | 3.07 | - | ||
Dielectric loss tangent Dielectric loss tangent/ASTMD150 | Dielectric tangent (60Hz) | ASTMD150 | 0.001 | - | |
Dielectric tangent (1kHz) | ASTMD150 | 0.001 | - | ||
Dielectric tangent (1MHz) | ASTMD150 | 0.003 | - | ||
Dielectric Strength Dielectric Strength/ASTMD149 | Dielectric strength (3.00mm) | ASTMD149 | kV/mm | 15 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/ASTMD955 | Mold shrinkage rate MD(0.318mm) | ASTMD955 | % | - | |
Mold shrinkage rate TD Mold shrinkage rate TD/ASTMD955 | Mold shrinkage TD (3.18mm) | ASTMD955 | % | - | |
MFR MFR/ASTMD1238 | MFR(400℃,2.16㎏) | ASTMD1238 | g/10min | 36 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Resin temperature | ℃ | - | ||
Mold Temperature Mold Temperature/ | Mold Temperature | ℃ | - | ||
Drying conditions Drying conditions/ | Drying conditions | ℃ | 150 | 4.0hr |
| Color |
|---|
Black, Natural |
| Main Applications |
|---|
Aircraft, Connectors, Dental Applications, Electrical/Electronic, Film, Hospital Supplies, Industrial Applications, Medical Equipment, Healthcare, Oil/Gas, Pump Parts, Seals, Surgical Instruments |
| Key Features |
|---|
Autoclave sterilization, biocompatibility, chemical resistance, ductility, electron beam sterilization, ethylene oxide sterilization, fatigue resistance, flame retardant, dimensional stability, impact resistance, sterilization, heat sterilizable, high flow, high heat resistance, radiation resistance, radiation sterilizable, radiation transmissive, steam resistance, steam sterilization |
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