Public Beta
Public Beta
| Manufacturer | Solvay Specialty Polymers Japan Co., Ltd. |
| Resin Name | HPPA |
| Product Name | Kalix |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ | Proportion | 1.55 | - | ||
Water absorption Water absorption/ASTMD570 | Water absorption rate (23℃, 24hr) | ASTMD570 | % | 0.09 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ISO75-2/B | Deflection temperature under load (0.45MPa, no annealing treatment) | ISO75-2/B | ℃ | 222 | - |
Deflection temperature under load (1.8MPa, no annealing treatment) | ISO75-2/A | ℃ | 213 | - | |
Glass transition temperature Glass transition temperature/ASTMD3418 | Glass transition temperature | ASTMD3418 | ℃ | 55 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile Yield Stress Tensile Yield Stress/ISO527-2 | Tensile Yield Stress | ISO527-2 | MPa | 230 | - |
Tensile strain at break Tensile strain at break/ISO527-2 | Tensile strain at break | ISO527-2 | % | 3.8 | - |
Tensile Modulus Tensile Modulus/ISO527-2 | Tensile Modulus | ISO527-2 | MPa | 19000 | - |
Bending strength Bending strength/ISO178 | Bending stress | ISO178 | MPa | 355 | - |
Flexural modulus Flexural modulus/ISO178 | Flexural modulus | ISO178 | MPa | 17000 | - |
Izod impact strength Izod impact strength/ISO180 | Izod impact strength (unnotched) | ISO180 | kJ/m＾2 | 95 | - |
Izod impact strength (notched) | ISO180/1A | kJ/m＾2 | 20 | - | |
Yield Strain Yield Strain/ | Bending elongation at break | % | 3.9 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Dielectric constant Dielectric constant/ASTMD2520 | Dielectric constant (2.40GHz) | ASTMD2520 | 3.77 | - | |
Dielectric loss tangent Dielectric loss tangent/ASTMD2520 | Dielectric loss tangent (2.40GHz) | ASTMD2520 | 0.013 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/Internal Method | Mold shrinkage rate MD | Internal Method | % | 0.15 | - |
Mold shrinkage rate TD Mold shrinkage rate TD/Internal Method | Mold shrinkage rate TD | Internal Method | % | 0.58 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Resin temperature | ℃ | - | ||
Mold Temperature Mold Temperature/ | Mold Temperature | ℃ | - | ||
Drying conditions Drying conditions/ | Drying conditions | ℃ | 80 | 4.0-12hr |
| Color |
|---|
Black,White |
| Main Applications |
|---|
Mobile Phones, Electrical Components, Electrical/Electronics, Thin-walled Components |
| Key Features |
|---|
Good dimensional stability, impact resistance, good appearance, high flow, high rigidity, high strength, hot water moldability, low moisture absorption, low warping, paintable, platable |
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