| Manufacturer | Solvay Specialty Polymers Japan Co., Ltd. |
| Resin Name | HPPA |
| Product Name | Kalix |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ | Proportion | 1.41 | - | ||
Water absorption Water absorption/ASTMD570 | Water absorption rate (23℃, 24hr) | ASTMD570 | % | 0.17 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Melting point Melting point/ | Melting point | ℃ | 223 | - | |
Flammability Flammability/UL94 | Flammability | UL94 | NaN | 0.40mm | |
Glass transition temperature Glass transition temperature/DMA | Glass transition temperature | DMA | ℃ | 65 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile strain at break Tensile strain at break/ISO527-2 | Tensile strain at break | ISO527-2 | % | 2.4 | - |
Tensile Modulus Tensile Modulus/ISO527-2 | Tensile Modulus | ISO527-2 | MPa | 10600 | - |
Bending strength Bending strength/ISO178 | Bending stress | ISO178 | MPa | 200 | - |
Flexural modulus Flexural modulus/ISO178 | Flexural modulus | ISO178 | MPa | 10000 | - |
Izod impact strength Izod impact strength/ISO180 | Izod impact strength (unnotched) | ISO180 | kJ/m^2 | 55 | - |
Izod impact strength (notched) | ISO180/1A | kJ/m^2 | 9 | - | |
Tensile strength Tensile strength/ISO527-2 | Tensile stress | ISO527-2 | MPa | 130 | - |
Yield Strain Yield Strain/ISO178 | Bending strain (breakage) | ISO178 | % | 2.6 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/Internal Method | Mold shrinkage rate MD | Internal Method | % | 0.2 | - |
Mold shrinkage rate TD Mold shrinkage rate TD/Internal Method | Mold shrinkage rate TD | Internal Method | % | 0.7 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Resin temperature | ℃ | - | ||
Mold Temperature Mold Temperature/ | Mold Temperature | ℃ | - | ||
Drying conditions Drying conditions/ | Drying conditions | ℃ | 4.0-12hr |
| Color |
|---|
Black |
| Main Applications |
|---|
Mobile Phones, Electrical Components, Electrical/Electronics, Thin-walled Components |
| Key Features |
|---|
High speed molding cycle, flame retardant, good dimensional stability, impact resistance, good appearance, high flow, high rigidity, high strength, hot water moldability, low warpage, paintable, platable |
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