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9950 | Kalix

Manufacturer

Solvay Specialty Polymers Japan Co., Ltd.

Resin Name

HPPA

Product Name

Kalix

ISO Material Code

-


Basic Properties

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PropertyDetailsInspection MethodsUnitValueNote

Density

Density/ASTMD792

Proportion

ASTMD792

1.6

-

Water absorption

Water absorption/ASTMD570

Water absorption rate (23℃, 24hr)

ASTMD570

%

0.37

-



Thermal Properties

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PropertyDetailsInspection MethodsUnitValueNote

Deflection Temperature under Load

Deflection Temperature under Load/ISO75-2/B

Deflection temperature under load (0.45MPa, no annealing treatment)

ISO75-2/B

262

-

Deflection temperature under load (1.8MPa, no annealing treatment)

ISO75-2/A

254

-

Melting point

Melting point/ASTMD3418

Melting point

ASTMD3418

260

-

Flammability

Flammability/UL94

Flammability

UL94

NaN

0.60mm,All colors



Mechanical Properties

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PropertyDetailsInspection MethodsUnitValueNote

Tensile Yield Stress

Tensile Yield Stress/ISO527-2

Tensile Yield Stress

ISO527-2

MPa

245

-

Tensile strain at break

Tensile strain at break/ISO527-2

Tensile strain at break

ISO527-2

%

2.3

-

Tensile Modulus

Tensile Modulus/ISO527-2

Tensile Modulus

ISO527-2

MPa

18500

-

Bending strength

Bending strength/ISO178

Bending strain stress (3.5%)

ISO178

MPa

379

-

Flexural modulus

Flexural modulus/ISO178

Flexural modulus

ISO178

MPa

15900

-

Izod impact strength

Izod impact strength/ISO180

Izod impact strength (unnotched)

ISO180

kJ/m^2

68

-

Izod impact strength (notched)

ISO180/1A

kJ/m^2

15

-



Electrical Properties

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PropertyDetailsInspection MethodsUnitValueNote

Dielectric constant

Dielectric constant/ASTMD2520

Dielectric constant (1.00GHz)

ASTMD2520

4.15

-

Dielectric constant (2.40GHz)

ASTMD2520

4.15

-

Dielectric loss tangent

Dielectric loss tangent/ASTMD2520

Dielectric loss tangent (1.00GHz)

ASTMD2520

0.011

-

Dielectric loss tangent (2.40GHz)

ASTMD2520

0.011

-



Building Properties

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PropertyDetailsInspection MethodsUnitValueNote

Mold shrinkage rate MD

Mold shrinkage rate MD/Internal Method

Mold shrinkage rate MD

Internal Method

%

0.13

-

Mold shrinkage rate TD

Mold shrinkage rate TD/Internal Method

Mold shrinkage rate TD

Internal Method

%

0.32

-



Standard Building Properties

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PropertyDetailsInspection MethodsUnitValueNote

Resin temperature

Resin temperature/

Resin temperature

-

Mold Temperature

Mold Temperature/

Mold Temperature

-

Drying conditions

Drying conditions/

Drying conditions

80

4.0-12hr



Filler Content Rate

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PropertyDetailsInspection MethodsUnitValueNote

Filler Content

Filler Content/

Filler content (GF)

%

50

-



Color

Black, colored, natural color, white

Main Applications

Mobile Phones, Electrical Components, Electrical/Electronics, Thin-walled Components

Key Features

High speed molding cycle, good dimensional stability, impact resistance, good appearance, high flow, high rigidity, high strength, hot water moldability, low warping, paintable, platable


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