Public Beta
Public Beta
| Manufacturer | Asahi Kasei Corporation |
| Resin Name | PPE+PS |
| Product Name | Zylon |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ISO 1183 | Density | ISO 1183 | g/cm^3 | 1.1 | - |
Water absorption Water absorption/ISO62 | Water absorption (24hr, 23℃) | ISO62 | % | 0.1 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ISO75-2/A | Deflection temperature under load (1.8MPa) | ISO75-2/A | ℃ | 108 | No annealing |
Linear expansion coefficient Linear expansion coefficient/ISO11359-2 | Linear expansion coefficient (-30℃ to 65℃) Parallel | ISO11359-2 | ×10^-5/℃ | 7.8 | - |
Linear expansion coefficient (-30℃ to 65℃) Vertical | ISO11359 | ×10^-5/℃ | 8.9 | - | |
Flammability Flammability/UL94 | Flammability | UL94 | NaN | 0.75mm,ALL | |
Flammability | UL94 | NaN | 3.0mm,ALL |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile Yield Stress Tensile Yield Stress/ISO527 | Tensile stress (yield point, 23℃) | ISO527 | MPa | 62 | - |
Tensile strain at break Tensile strain at break/ISO527 | Tensile breaking strain (23℃) | ISO527 | % | 14 | - |
Bending strength Bending strength/ISO178 | Bending strength (23℃) | ISO178 | MPa | 96 | - |
Flexural modulus Flexural modulus/ISO178 | Flexural modulus (23℃) | ISO178 | MPa | 2220 | - |
Charpy impact strength Charpy impact strength/ISO179 | Charpy impact strength (4mm 23℃ notched) | ISO179 | KJ/m^2 | 42 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Volume resistivity Volume resistivity/IEC60093 | Volume resistivity (23℃) | IEC60093 | Ω・cm | NaN | - |
Surface resistance Surface resistance/IEC60093 | Surface resistance | IEC60093 | Ω | NaN | - |
Dielectric constant Dielectric constant/IEC60250 | Dielectric constant (1.00GHz) | IEC60250 | 2.9 | - | |
Dielectric constant (10.0GHz) | IEC60250 | 2.7 | - | ||
Dielectric loss tangent Dielectric loss tangent/IEC60250 | Dielectric loss tangent (1.00GHz) | IEC60250 | 0.0041 | - | |
Dielectric loss tangent (10.0GHz) | IEC60250 | 0.0046 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage Mold shrinkage/Asahi Kasei Process | Molding shrinkage rate (150 x 150 x 2 mm) | Asahi Kasei Process | % | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Resin temperature Resin temperature/ | Molding (melting) temperature | ℃ | - | ||
Mold Temperature Mold Temperature/ | Mold Temperature | ℃ | - | ||
Drying conditions Drying conditions/ | Drying temperature | ℃ | 2～4Hr |
| Key Features |
|---|
Halogen-free, high impact resistance, flame retardant |
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