| Manufacturer | Asahi Kasei Corporation |
| Resin Name | PA66 |
| Product Name | LEONA |
| ISO Material Code | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Density Density/ISO1183 | Density | ISO1183 | g/cm^3 | 1.46 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Deflection Temperature under Load Deflection Temperature under Load/ISO75 | Deflection temperature under load (load 1.8 MPa) | ISO75 | ℃ | 235 | - |
Deflection temperature under load (load 0.45 MPa) | ISO75 | ℃ | 250 | - | |
Linear expansion coefficient Linear expansion coefficient/ASTMD 700 | Linear expansion coefficient | ASTMD 700 | ×10^-9/℃ | 1.2 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Tensile breaking stress Tensile breaking stress/ISO527 | Tensile breaking stress (23℃ 50% RH) | ISO527 | MPa | 230 | - |
Tensile strain at break Tensile strain at break/ISO527 | Tensile breaking strain (23℃ 50%RH) | ISO527 | % | 3 | - |
Tensile Modulus Tensile Modulus/ISO527 | Tensile modulus (Young's modulus, 23℃ 50% RH) | ISO527 | MPa | 13000 | - |
Bending strength Bending strength/ISO178 | Bending strength (23℃ 50% RH) | ISO178 | MPa | 320 | - |
Flexural modulus Flexural modulus/ISO178 | Flexural modulus (23℃) | ISO178 | MPa | 13000 | - |
Charpy impact strength Charpy impact strength/ISO179 | Charpy impact strength (notched) | ISO179 | KJ/m^2 | 15 | - |
Surface hardness Surface hardness/ISO2039 | Rockwell hardness (M scale) | ISO2039 | M | 102 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Volume resistivity Volume resistivity/IEC 60093 | Volume resistivity (23℃ 50% RH) | IEC 60093 | Ω・cm | NaN | - |
Surface resistance Surface resistance/IEC 60093 | Surface resistance (23℃50%RH) | IEC 60093 | Ω | NaN | - |
Dielectric Strength Dielectric Strength/IEC 60243 | Dielectric Breakdown Strength | IEC 60243 | kV/mm | 40 | - |
Tracking resistance Tracking resistance/IEC 60116 | Tracking index (7mm) | IEC 60116 | V | 575 | - |
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| Property | Details | Inspection Methods | Unit | Value | Note |
|---|---|---|---|---|---|
Mold shrinkage rate MD Mold shrinkage rate MD/Asahi Kasei Process | Mold shrinkage (flow direction/transverse direction) | Asahi Kasei Process | % | 0.2 | - |
Mold shrinkage rate TD Mold shrinkage rate TD/Asahi Kasei Process | Mold shrinkage (flow direction/transverse direction) | Asahi Kasei Process | % | 0.7 | - |
| Key Features |
|---|
High rigidity when absorbing water |
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